Full-automatic Diamond Wire Multi-silicon Squaring Machine

Introduction:

GC-GP750 is an all-in-one machine for chamfering, grinding and polishing of different sizes of mono-silicon materials after squaring. It also has rough grinding, fine grinding, and chamfering function.


Equipment characteristics:

Low cost

High production capacity

Easy operation

Compact structure and small floor space


Advantages:

1.Maximum speed of 45m/s, with high grinding efficiency

2.Improve fast-speed blade matching, and repair empty travel

3.Provided with cooling water pump booster to improve flow water rate and pressure and therefore increase grinding radiation efficiency.

4.Provided with auto blade self-repair function to improve the precision of workpiece and cleanness.


Technical parameters

Items

Parameters

Workpiece types

G6/G7/G8

Workpiece size

1400×1400×420(Max500)mm

Wire diameter

0.35 - 0.42mm

Max. wire storage

10km * 2

Squaring diameter

155mm ~166mm

Feed speed

0~3.5mm / min

Wire consume

900m/ silicon ingot

Wire speed

0 ~ 25m / s

Wire tension

0 ~ 140N

Overall dimension

10000(L)×3200(W)×3800(H)mm

Machine weight

30000kg


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