Poly306 Multi-silicon Brick Cutting Machine

Equipment Introduction

The product named Poly306 Diamond Wire Multi-silicon Cutting Machine is a machine using a diamond wire to cut and process muiti-silicon brick. It employs a processing technique in which silicon bricks are cut into sections through a diamond wire reciprocating at high speed. This machine is mainly used for processing multi-silicon , can simultaneously cut several bricks and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy,low footprint.,convenient in operation, and also can be configured with machine hand to reduce workload or can be configured with robot for automatic production line.

Technical Parameter:

Items

Parameters

Workpiece size

160×160×450mm

Wire diameter

0.3 - 0.45mm

Feed speed

1 – 30mm / min

Wire speed

0 – 25m / s

Acceleration time

3s

Wire consume

3m / 刀口

 Processing quantity

6

Cutting time

8min

Worktable moving speed

0 – 300 mm / min

Max. wire storage

10000m(配套BS60工字輪,可直接上機切割)

Wire tension

0 – 130N

Overall dimension

3400×2300×1900mm

Machine weight

6000kg


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